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Principles and typical applications of precision laser etching technology

Principles of laser etching technology

The basic principle of laser etching is to focus a high-beam quality low-power laser beam (usually ultraviolet laser, fiber laser) into a very small spot, forming a high power density at the focal point, so that the material vaporizes and evaporates in an instant, forming a hole , Feng, slot. Its processing technology includes laser micro-nano cutting, scribing, etching, drilling and so on.

Characteristics of laser etching technology

The characteristic of laser etching is to use the laser's non-contact processing, high degree of flexibility, fast processing speed, no noise, small heat-affected zone, and a very small spot that can be focused to the laser wavelength level to obtain good processing performance. The dimensional accuracy and processing quality of drilling, scribing, etching and cutting, especially the interaction with certain materials (such as polyimide) are "cold processing" of "photochemical action", which can obtain a non-carbonization effect. It is widely used in the processing of semiconductor materials.

Yuanlu Optoelectronics Laser Etching Parameter Table

Typical application of UV laser etching technology

1) Thin film laser etching application

advantage:

High repetition rate, high power and fast material removal rate, no chemical corrosion and environmental pollution

The coating laser etching machine is a precision equipment that uses laser to perform electrode etching on the ITO coating on ITO Glass and ITO Film. It can perform various patterns on a wide range of ITO coatings, polycrystalline films and other oxide films on glass and PET substrates, precision and high-speed etching of various sizes, and processing a variety of electrodes. Especially suitable for electrode etching of mobile phone touch screen.