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Combination of A Variety of Thermal Management Materials to Solve The Heat Dissipation Problem of LED Drive Power

The LED driving power supply is also a kind of power supply, but a specific power supply, which drives the LED to emit light with voltage or current. The core components of the LED drive power supply include switching controllers, inductors, switching components (Mosfet), feedback resistors, input filter components, output filter components, and so on.

LED is an energy-saving product, and the efficiency of the drive power supply should be high. It is very important for the heat dissipation of the junction of the power supply installed in the luminaire. The efficiency of the power supply is high, its power consumption is small, and the heat generated in the lamp is small, which reduces the temperature rise of the lamp. It is beneficial to delay the light decay of LED.

In the prior art, in order to obtain good insulation protection for the driving power supply, the driving power supply is usually assembled in a sealed cavity, which is extremely unfavorable for the heat dissipation of the driving power supply. To cope with this challenge, the selected thermal management materials must meet the performance of heat dissipation, insulation and waterproofing at the same time. The correct installation and good insulation of the product will enhance the vitality of the LED power supply.

The use of potting glue to potting the drive power supply can not only achieve the effects of insulation and fixation, waterproof and shock resistance, but also improve the heat dissipation capacity of the drive power supply and ensure that the drive power supply can work stably for a long time.

Chip heating is mainly for high-voltage drive chips with built-in power modulators, and the power consumption of the chip can be dispersed to devices outside the chip through thermal grease (Tgrease2500) or thermal pads (Tflex HD300, Tflex HD700). Power devices use thermally conductive insulating sheets (Tgard series) to ensure insulation performance while transferring heat.